Dr. Debendra Das Sharma is an Intel Senior Fellow and Chief I/O Architect, Data Center Group, at Intel Corporation. He is a member of NAE, Fellow of IEEE, and Fellow of International Academy of AI Sciences (AAIS). He is a leading expert on I/O subsystem and interface architecture. He delivers Intel-wide critical interconnect technologies in Peripheral Component Interconnect Express (PCIe), Compute Express Link (CXL), Universal Chiplet Interconnect Express (UCIe), and Intel’s Coherency interconnect, as well as their implementation. He is a member of the Board of Directors for the PCI Special Interest Group (PCI-SIG®). He is a co-inventor, founding member, and chair of the UCIe and CXL consortia. He has been a lead contributor to PCIe, CXL, and UCIe specifications since their inception.
Dr. Das Sharma has a bachelor’s in technology (with honors) degree in Computer Science and Engineering from the Indian Institute of Technology, Kharagpur and a Ph.D. in Computer Engineering from the University of Massachusetts, Amherst. He holds 230+ US patents and 500+ patents world-wide. He is a frequent keynote/ plenary speaker, distinguished lecturer, invited speaker, invited columnist, and panelist at Nature Electronics, IEEE International Test Conference, IEEE Hot Interconnects, IEEE Cool Chips, IEEE 3DIC, SNIA SDC, PCI-SIG Developers Conference, CXL consortium, Open Server Summit, Open Fabrics Alliance, Flash Memory Summit, Intel Innovation, and Universities (CMU, Texas A&M, Georgia Tech, UIUC, UC Irvine). He has been awarded the Distinguished Alumnus Award from Indian Institute of Technology, Kharagpur in 2019, the IEEE Region 6 Outstanding Engineer Award in 2021, the first PCI-SIG Lifetime Contribution Award in 2022, the IEEE Circuits and Systems Industrial Pioneer Award in 2022, and the IEEE Computer Society Edward J. McCluskey Technical Achievement Award in 2024.